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US 11,456,273 B2Granted
Bonding head and a bonding apparatus having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJaecheol Kim, Gilman Kang, Yongdae Ha
Life of this patent
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Abstract
A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.
Claims11
A bonding apparatus, comprising:
- a substrate holder to which a first chip is secured, the first chip including a plurality of contact pads;
- and
- a bonding head configured to apply thermal compression to a second chip having a plurality of bonding units and mounted on the first chip;
- wherein the bonding head includes:
- a base body;
- a bonding heater disposed on the base body and generating a melting heat;
- a bonding tool disposed on the bonding heater, the bonding tool compressing the second chip against the first chip while transferring a melting heat to the second chip to thereby bond the second chip to the first chip by the thermal compression;
- and
- a heat controller disposed in the bonding tool, wherein the heat controller has a lower thermal conductivity than a thermal conductivity of the bonding tool, and wherein the heat controller contacts the bonding tool on a bottom surface thereof and on side surfaces thereof.
6 more elements
A bonding apparatus, comprising:
- a substrate holder to which a first chip is secured, the first chip including a plurality of contact pads;
- and
- a bonding head configured to apply thermal compression to a second chip having a plurality of bonding units and mounted on the first chip;
- wherein the bonding head includes:
- a base body;
- a bonding heater disposed on the base body and generating a melting heat;
- a bonding tool disposed on the bonding heater, the bonding tool compressing the second chip against the first chip while transferring a melting heat to the second chip to thereby bond the second chip to the first chip by the thermal compression;
- and
- a heat controller disposed in the bonding tool, wherein the heat controller has a lower thermal conductivity than a thermal conductivity of the bonding tool,
- wherein the bonding head further includes a subsidiary heater disposed at a side surface of the bonding tool such that a subsidiary melting heat generated from the subsidiary heater is transferred to the first chip or the second chip from the side surface of the bonding tool.
7 more elements
A bonding apparatus, comprising:
- a substrate holder to which a first chip is secured, the first chip including a plurality of contact pads;
- and
- a bonding head configured to apply thermal compression to a second chip having a plurality of bonding units and mounted on the first chip;
- wherein the bonding head includes:
- a base body;
- a bonding heater disposed on the base body and generating a melting heat;
- a bonding tool disposed on the bonding heater, the bonding tool compressing the second chip against the first chip while transferring a melting heat to the second chip to thereby bond the second chip to the first chip by the thermal compression;
- and
- a heat controller disposed in the bonding tool, wherein the heat controller has a lower thermal conductivity than a thermal conductivity of the bonding tool,
- wherein the bonding apparatus further comprises a head separator far separating the bonding head from the second chip after the second chip is bonded to the first chip by the thermal compression, and
- wherein the head separator includes:
- a separation strap interposed between the bonding tool and the second chip when the second chip is compressed to the first chip;
- and
- fixed rollers at opposite portions of the separation strap.
11 more elements
Dependencies are inferred from the claim text.