High strength bonding tool and a process for production of the same

A mounting tool comprising a rectangular frame-shaped hollow square frustum, having an end surface to be a pressing surface, the rectangular frame-shaped end surface consisting of a coating of a polycrystalline diamond oriented in the (100) plane and/or (110) plane in the thickness direction, formed by a gaseous phase synthesis method, the thickness of said coating being 15 to 100 .mu.m, the surface being of a mirror surface with a surface roughness of at most 0.1 .mu.m by Rmax representation and having such a property that when the maximum temperature of the pressing surface is in the range of 220 to 600.degree. C., the flatness of the pressing surface is at most 3 .mu.m and the maximum temperature gradient in the pressing surface is at most 20.degree. C.

A mounting tool comprising a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface, having a rectangular frame-shaped end surface of a hollow square frustum, to be a pressing surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C. and a polycrystalline diamond coating formed on the above described surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating having a mirror surface with a surface roughness of at most 0.1 .mu.m by Rmax representation and such a property that the maximum temperature gradient in the pressing surface is at most 20.degree. C.

A tool used for directly mounting LSI on a substrate by a flip chip method, comprising a pressing surface of a tool end, the pressing surface consisting of polycrystalline diamond formed by a gaseous phase synthesis method, the pressing surface being of a mirror surface with a surface roughness of at most 0.1 .mu.m by Rmax representation, having at least one vacuum adsorption hole made in the surface and having such a property that when the highest temperature of the pressing surface is in the range of 230 to 400.degree. C., the flatness of the pressing surface is at most 5 .mu.m and the maximum temperature gradient in the pressing surface is at most 30.degree. C.

A flip chip mounting tool comprising a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface, having a pressing surface at the tool end and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C., and a polycrystalline diamond coating formed on the above described surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating having a mirror surface with a surface roughness of at most 0.1 .mu.m by Rmax representation, having at least one vacuum adsorption hole made in the surface and having such a property that when the highest temperature of the pressing surface is in the range of 230 to 400.degree. C., the flatness of the pressing surface is at most 5 .mu.m and the maximum temperature gradient in the pressing surface is at most 30.degree. C.