Mounting method and mounting apparatus for electronic part

A mounting apparatus of a flip-chip having a plurality of bonding areas said bonding areas constituting bumps, utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system which monitors the connection of a plurality of bonding areas on said flip-chip to assure a non-defective bond thereof comprising:

• an ultrasonic vibration generating device;
• a horn attached to the ultrasonic vibration generating device;
• a collet tool for holding a flip-chip attached to said horn;
• a control unit being connected to the ultrasonic vibration generating device;
• a substrate conductor heating unit connected to said control unit;
• a height measuring device for monitoring a height of the flip-chip with respect to a substrate conductor connected to the control unit, by monitoring a first bump sinking amount and a second bump sinking amount of a flip-chip having a plurality of bumps thereon;
• and
• a vibration measuring device for monitoring a vibrating state of a plurality of bonding areas of the flip-chip connected with said control unit;
• wherein the control unit controls operation of the ultrasonic vibration generating device based on change in height between the flip-chip and the substrate conductor heating unit and on the vibrating state of the plurality of bonding areas of the flip-chip.