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US 11,515,171 B2Granted
Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices
AssigneeMicron Technology, Inc.
InventorsXiaopeng Qu, Hyunsuk Chun, Brandon P. Wirz, Andrew M. Bayless
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Abstract
This patent application relates to methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices with heat applied from a bond head of a thermocompression bonding tool. The stack is substantially enclosed within a skirt carried by the bond head to reduce heat loss and contaminants from the stack, and heat may be added from the skirt.
Claims37
A thermocompression bonding apparatus, comprising:
- a bond stage;
- a bond head movable in X, Y and Z directions, the bond head including:
- a bond tip having a compression surface on an underside thereof, the bond tip including a primary heating device;
- and
- a skirt carried by and movable with the bond head, the skirt extending vertically downward from the bond head surrounding the bond tip and laterally encompassing an open-bottomed chamber sized to encompass a single stack of microelectronic devices.
2 more elements
A method, comprising:
- aligning a bond head of a thermocompression bonding tool with a stack of two or more microelectronic devices supported on a substrate;
- lowering the bond head over the stack of microelectronic devices to surround and substantially enclose the stack in a chamber within a skirt secured to and extending vertically downward from the bond head and to contact an uppermost microelectronic device of the stack with a bond tip of the bond head within the chamber;
- applying heat from the bond tip to the stack of microelectronic devices through the uppermost microelectronic device;
- and
- reducing heat loss from the bond tip through the stack of microelectronic devices and from a periphery of the stack with the skirt.
2 more elements
A method, comprising:
- aligning a bond head of a thermocompression bonding tool with a stack of microelectronic devices;
- lowering a bond head of a thermocompression bonding tool over the stack of microelectronic devices;
- heating the stack of microelectronic devices with the bond head;
- and
- substantially containing contaminant material outgassed from bondlines between microelectronic devices of the stack responsive to the heating within a chamber surrounded by a skirt carried by the bond head and substantially enclosing the stack.
2 more elements
Dependencies are inferred from the claim text.