Semiconductor inner lead bonding tool
AssigneeTessera, Inc.
InventorsThomas H. Distefano, Igor Y. Khandros, Gaetan Mathiew, Jason Sweis, John Grange, Gary W. Grube
Life of this patent
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Abstract
A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.
Claims19
A tool for bonding leads to contacts on semiconductor chips, said tool comprising a body having a lower end defining a bonding surface region, and guide surfaces for engaging elongated leads disposed beneath said lower end upon downward movement of said tool from above such leads, said guide surfaces being adapted to engage an elongated lead extending generally in a first horizontal direction beneath said lower end and guide such lead generally in a second horizontal direction orthogonal to said first horizontal direction so as to align such lead with said bonding region, said guide surfaces also being adapted to engage an elongated lead extending generally in said second horizontal direction beneath said lower end and to guide such lead generally in said first horizontal direction so as to align such lead with said bonding region.
A method of making connections to contacts on the front surface of a part of a semiconductor chip assembly comprising the steps of:
- (a) juxtaposing a connection component having leads with elongated connection sections extending in mutually orthogonal first and second directions with the part so that a bottom surface of a support structure in said connection component faces the front surface of the part and so that the connection sections of the leads on the connection component overly said contacts on said chip in crude alignment therewith;
- (b) bonding the connection section of each said lead to one said contact by aligning a tool with the contact to be bonded and displacing the tool downwardly to engage the lead with the tool and thereby bring the connection section into more precise alignment with the contact, and continuing said downward motion to engage the lead with the contact;
- and
- (c) moving said tool and part relative to one another to align the tool with all of said contacts seriatim and repeating said bonding step for each contact, said tool being maintained in substantially constant orientation relative to said part during said moving and repeated bonding steps.
Dependencies are inferred from the claim text.