Bond head design for thermal compression bonding
AssigneeIntel Corporation
InventorsMichael Baker, Feras Eid, Wenhao Li, Zhaozhi Li, Pilin Liu
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Abstract
Microelectronic die package structures formed according to some embodiments may include a thermal compression bonding (TCB) assembly including a bond head with a first thermal zone separated from a second thermal zone by a thermal separator, the thermal separator extending through a thickness of the bond head. A bond head nozzle is coupled to a first side of the bond head, where the bond head nozzle includes one or more nozzle channels extending through a thickness of the bond head nozzle.
Claims20
A thermal compression bonding (TCB) assembly comprising:
- a bond head comprising a first thermal zone separated from a second thermal zone by a thermal separator extending through a thickness of the bond head;
- and
- a bond head nozzle coupled to a first side of the bond head, wherein the bond head nozzle comprises one or more nozzle channels extending through a thickness of the bond head nozzle.
A thermal compression bonding system comprising;
- a bond head comprising a first thermal zone separated from a second thermal zone by a thermal separator extending through a thickness of the bond head;
- a bond head nozzle coupled to a first side of the bond head, wherein the bond head nozzle comprises one or more nozzle channels extending through a thickness of the bond head nozzle;
- and
- a pedestal coupled to the bond head.
A method of thermal compression bonding, the method comprising:
- placing a microelectronic substrate on a surface of pedestal;
- heating the pedestal;
- placing a microelectronic die on a bond head coupled to the pedestal, the bond head comprising a first thermal zone separated from a second thermal zone by a thermal separator extending through a thickness of the bond head;
- independently heating the first thermal zone and the second thermal zone to different temperatures;
- and
- bonding the microelectronic die to the microelectronic substrate.
Dependencies are inferred from the claim text.