Bonding tool and its fabrication

A bonding tool comprising:

• a holder having a substrate mounted at an end thereof, said holder including means for receiving a heating element;
• and
• a tip disposed on said substrate;
• said substrate comprising a ceramic material having an electrical resistivity of less than 1000 ohm-cm and a thermal conductivity of at least 60 W(m.multidot..degree.K).sup.-1.

A bonding tool, comprising:

• a holder having a tip mounted at an end thereof, said holder including means for receiving a heating element;
• said tip comprising a ceramic material selected from the group consisting of:
• silicon carbide sintered with titanium diboride;
• aluminum nitride doped with at least one dopant selected from yttrium oxide, calcium oxide, dysprosium oxide, and ytterbium oxide;
• and silicon carbide doped with at least one dopant selected from beryllium and beryllium oxide.

A bonding tool, comprising:

• a holder having a substrate mounted at an end thereof, said holder including means for receiving a heating element;
• and
• a tip disposed on said substrate;
• said substrate comprising a ceramic material selected from the group consisting of:
• silicon carbide sintered with titanium diboride;
• aluminum nitride doped with at least one dopant selected from yttrium oxide, calcium oxide, dysprosium oxide, and ytterbium oxide;
• and silicon carbide doped with at least one dopant selected from beryllium and beryllium oxide.

A method for making a bonding tool, comprising the steps of:

• providing a ceramic substrate having an electrical resistivity of less than 1000 ohm-cm and a thermal conductivity of at least 60 W(m.multidot..degree.K).sup.-1 ;
• electrical discharge machining a surface of said substrate into a predetermined shape;
• and
• mounting said substrate on a holder.

A method for making a bonding tool, comprising the steps of:

• providing a ceramic substrate comprising a ceramic material selected from the group consisting of:
• silicon carbide sintered with titanium diboride;
• aluminum nitride doped with at least one dopant selected from yttrium oxide, calcium oxide, dysprosium oxide, and ytterbium oxide;
• and silicon carbide doped with at least one dopant selected from beryllium and beryllium oxide;
• electrical discharge machining a surface of said substrate into a predetermined shape;
• and
• mounting said substrate on a holder.

A bonding tool, comprising:

• a holder having a substrate mounted at an end thereof, said substrate comprising a compact of polycrystalline diamond particles;
• a polycrystalline diamond film disposed on said substrate to form a tip;
• and
• means for coupling said substrate to a source for heating.