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US 2025/0273618 A1Published application
Thermal compression bonding with contact area adjustment
AssigneeInternational Business Machines Corporation
InventorsPrabudhya Roy Chowdhury, Katsuyuki Sakuma, Sathyanarayanan Raghavan
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Abstract
A thermal compression bonding apparatus and assembly are provided in which the contact area between a thermal compression bonding head nozzle and a semiconductor component that is closest to the thermal compression bonding head nozzle has been modified/adjusted to mitigate temperature non-uniformity from the center to the corner of the semiconductor component. This mitigation in temperature non-uniformity improves the uniformity of bonding quality across the semiconductor package.
Claims16
An apparatus comprising:
- a thermal compression bonding head nozzle comprising a first region and a second region located on a first side of the thermal compression bonding head nozzle that is configured to face a semiconductor component, wherein the first region comprises at least one recessed area surrounded by a semiconductor component contacting area, wherein the at least one recessed area prevents contact of the semiconductor component with the thermal compression bonding head nozzle and wherein the second region surrounds the first region and has a non-semiconductor component contacting surface.
An assembly comprising:
- a thermal compression bonding apparatus comprising a thermal compression bonding head nozzle comprising a first region and a second region located on a first side of the thermal compression bonding head nozzle, wherein the first region comprises a semiconductor component contacting area and the second region surrounds the first region and has a non-semiconductor component contacting surface;
- a first semiconductor component having at least one recessed area present therein, wherein the first semiconductor component and the at least one recessed area face the first side of the thermal compression bonding head nozzle;
- and
- a second semiconductor component located beneath the first semiconductor component.
1 more element
Dependencies are inferred from the claim text.