Y10T 29/53183
Multilead component
Y10T29/53183 (Multilead component) appears on 859 US grants and 352 published applications in this corpus.
Search patents in Y10T- Granted patents
- 859
- Published applications
- 352
- Assignees
- 276
- Inventors
- 1,328
- Latest grant
- 10 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 8 | 0 |
| 1978 | 14 | 0 |
| 1979 | 12 | 0 |
| 1980 | 16 | 0 |
| 1981 | 16 | 0 |
| 1982 | 10 | 0 |
| 1983 | 14 | 0 |
| 1984 | 14 | 0 |
| 1985 | 18 | 0 |
| 1986 | 43 | 0 |
| 1987 | 23 | 0 |
| 1988 | 36 | 0 |
| 1989 | 36 | 0 |
| 1990 | 15 | 0 |
| 1991 | 12 | 0 |
| 1992 | 14 | 0 |
| 1993 | 20 | 0 |
| 1994 | 15 | 0 |
| 1995 | 6 | 0 |
| 1996 | 17 | 0 |
| 1997 | 10 | 0 |
| 1998 | 23 | 0 |
| 1999 | 16 | 0 |
| 2000 | 28 | 0 |
| 2001 | 35 | 22 |
| 2002 | 31 | 36 |
| 2003 | 34 | 21 |
| 2004 | 30 | 26 |
| 2005 | 32 | 34 |
| 2006 | 36 | 32 |
| 2007 | 30 | 14 |
| 2008 | 18 | 31 |
| 2009 | 22 | 17 |
| 2010 | 16 | 21 |
| 2011 | 17 | 29 |
| 2012 | 32 | 18 |
| 2013 | 19 | 6 |
| 2014 | 22 | 4 |
| 2015 | 9 | 9 |
| 2016 | 0 | 4 |
| 2017 | 5 | 2 |
| 2018 | 7 | 5 |
| 2019 | 5 | 2 |
| 2020 | 2 | 5 |
| 2021 | 4 | 5 |
| 2022 | 2 | 3 |
| 2023 | 4 | 3 |
| 2024 | 4 | 2 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- 3D system integration10 Jun 2025US 12,327,783 B2BroadPak Corporation
- Secure semiconductor integration and method for making thereof18 Mar 2025US 12,255,189 B2BroadPak Corporation
- Cable processing machine apparatus3 Sep 2024US 12,080,981 B2Komax Holding AG
- 3D integrations and methods of making thereof20 Aug 2024US 12,068,231 B2BroadPak Corporation
- Clinch mechanism for assembling a printed circuit board with electronic components13 Feb 2024US 11,903,137 B2Universal Instruments Corporation
- 2.5d/3d system integration28 Aug 2025US 2025/0273553 A1BroadPak Corporation
- Apparatus and method for making a secured substrate24 Oct 2024US 2024/0355722 A1BroadPak Corporation
- 3d system integration18 Apr 2024US 2024/0128238 A1BroadPak Corporation
- Method of mounting suitable for positioning reeved components on a printed circuit board PCB11 May 2023US 2023/0147544 A1Fitech Sp. z o.o.
- 3d heterogeneous integrations and methods of making thereof9 Feb 2023US 2023/0041977 A1BroadPak Corporation
Most cited
By later US patents
- Semiconductor interposer integration241US 9,893,004 B2BroadPak Corporation · 2018
- Stacking integrated circuits containing serializer and deserializer blocks using through silicon via210US 8,014,166 B2BroadPak Corporation · 2011
- Component mounting method167US 7,353,596 B2Matsushita Electric Industrial Co., Ltd. · 2008
- Electronic component mounting apparatus and electronic component mounting method164US 7,033,842 B2Matsushita Electric Industrial Co., Ltd. · 2006
- Component mounting apparatus163US 7,797,820 B2Panasonic Corporation · 2010