Apparatus and method for making a secured substrate
AssigneeBroadPak Corporation
InventorFarhang YAZDANI
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Abstract
Methods of forming secured substrates are presented. These methods involve creating signal-blocking vias and a series of meshes on various layers of an electronic substrate to mask signal traces and prevent tampering. By strategically positioning ground and power meshes on different layers, and optionally including dummy meshes, the method significantly increases the privacy and security of the electronic substrate. These techniques can also be applied inside or on integrated circuits to enhance security.
Claims16
A method for enhancing security of a substrate by minimizing or eliminating tampering, the method comprising:
- forming a ground mesh on a first layer of the substrate;
- forming a power mesh on a second layer of the substrate, wherein the power mesh being staggered with respect to the ground mesh on the first layer;
- and
- positioning signal traces on a third layer, wherein the ground mesh and the power mesh mask the signal traces to increase privacy and security.
An apparatus for enhancing security of a substrate by minimizing or eliminating tampering, the apparatus comprising:
- signal vias configured to transmit signals through the substrate;
- and
- a column of signal-blocking vias positioned adjacent to the signal vias, wherein the signal-blocking vias include ground supply, power supply, or dummy vias, wherein
- the signal-blocking vias being more closely spaced together compared to the signal vias to discourage propagation of electromagnetic signals outside a semiconductor package.
Dependencies are inferred from the claim text.