Electronic component mounting apparatus and electronic component mounting method

An electronic component mounting apparatus, for applying viscous liquid to multiple projecting electrodes formed on a projecting electrode formation face of an electronic component, and for mounting the electronic component on a work, comprising:

• a viscous liquid supply unit for supplying the viscous liquid that is spread out and evenly distributed during a flattening stage;
• an arrangement means for arranging the electronic component on the evenly distributed viscous liquid while the projecting electrodes continue to contact the viscous liquid;
• a mounting unit having a mounting head that includes a mounting nozzle and used for the vacuum chucking of the electronic component, said mounting unit for extracting the electronic component arranged on the viscous liquid using the mounting nozzle and for mounting the electronic component on the work;
• an electronic component recognition unit having a camera for obtaining images of the electronic component held by the mounting nozzle, for employing an image obtained by the camera to identify the location of the electronic component;
• and
• a mounting controller for controlling the mounting unit based on the recognition results obtained by the electronic component recognition unit, and for positioning, on the work, the electronic component held by the mounting nozzle,
• wherein the arrangement means includes a holding head for holding the electronic component, from the reverse face thereof, while the projecting electrode formation face is directed upward, wherein the holding head is vertically inverted relative to the stage, and the electronic component held by the holding head is placed on the viscous liquid.

An electronic component mounting method, for applying viscous liquid to multiple projecting electrodes formed on a projecting electrode formation face of an electronic component, and for mounting the electronic component on a work, comprising:

• a liquid level evening step of spreading out and leveling the viscous liquid on a flat stage;
• a holding step to hold the electronic component with the projecting electrodes in an upward direction;
• an inversion step to invert the electronic component so the electrodes contact the viscous liquid;
• an extraction step of separating the electronic component from the viscous liquid by vacuum chucking using a mounting nozzle of a mounting head;
• a component recognition step of using a camera to obtain images of the electronic component held by the mounting nozzle, and of employing the obtained images to identify the location of the electronic component;
• and
• a mounting step, based on the recognition results obtained at the component recognition step, of moving the mounting head in order to position the electronic component on a work, and of mounting the electronic component on the work.

An electronic component mounting method, for applying viscous liquid to multiple projecting electrodes formed on a projecting electrode formation face of an electronic component, and for mounting the electronic component on a work, comprising:

• a liquid level evening step of spreading out and leveling the viscous liquid on a flat stage;
• an arrangement step of arranging the electronic component on the viscous liquid having an even liquid level, while the projecting electrodes contact the viscous liquid;
• an extraction step of separating the electronic component from the viscous liquid by vacuum chucking using a mounting nozzle of a mounting head;
• a component recognition step of using a camera to obtain images of the electronic component held by the mounting nozzle, and of employing the obtained images to identify the location of the electronic component;
• and
• a mounting step, based on the recognition results obtained at the component recognition step, of moving the mounting head in order to position the electronic component on a work, and of mounting the electronic component on the work,
• wherein, at the arrangement step, the holding head by which the reverse face of the electronic component is vacuum-chucked while the projecting electrode formation face is directed upward, is vertically inverted relative to the stage, so that the electronic component held by a holding head can be placed on the viscous liquid having an even liquid level.

An electronic component mounting apparatus, for applying viscous liquid to multiple projecting electrodes formed on a projecting electrode formation face of an electronic component, and for mounting the electronic component on a work, comprising:

• an electronic component feeding unit for feeding multiple electronic components with the projecting electrode formation faces directed upward;
• a viscous liquid supply unit for supplying the viscous liquid that is spread out and evenly distributed during a flat stage;
• an inversion unit for holding, inverting, and arranging the electronic component on the evenly distributed viscous liquid while the projecting electrodes continue to contact the viscous liquid;
• a mounting unit having a mounting head that includes mounting nozzles and used for the vacuum chucking of the electronic components, said mounting unit for extracting the electronic components arranged on the viscous liquid using the mounting nozzles and for mounting the electronic components on a work;
• an electronic component recognition unit having a camera for obtaining images of the electronic components held by the mounting nozzles, for employing an image obtained by the camera to identify the locations of the electronic components;
• and
• a mounting controller for controlling the mounting unit based on the recognition results obtained by the electronic component recognition unit, and for positioning, on the work, the electronic components held by the mounting nozzles.

An electronic component mounting method, for applying viscous liquid to multiple projecting electrodes formed on a projecting electrode formation face of an electronic component, and for mounting the electronic component on a work, comprising:

• a transfer step of using multiple mounting nozzles of a mounting head to pick up multiple electronic components supplied with the projecting electrode formation faces directed upward, and transferring the electronic components while the reverse faces thereof are held by electronic component holders of the holding head;
• a coating step of inverting and arranging, on the viscous liquid spread on a flat stage, the electronic components held by the holding head, and applying the viscous liquid on the projecting electrodes of the electronic components;
• and
• a mounting step of employing the mounting nozzles of the mounting head to remove the multiple components from the flat stage and to mount the electronic components on a work.