Y10T 29/53174
Means to fasten electrical component to wiring board, base, or substrate
Y10T29/53174 (Means to fasten electrical component to wiring board, base, or substrate) appears on 2,986 US grants and 1,805 published applications in this corpus.
Search patents in Y10T- Granted patents
- 2,986
- Published applications
- 1,805
- Assignees
- 881
- Inventors
- 4,593
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 14 | 0 |
| 1978 | 30 | 0 |
| 1979 | 24 | 0 |
| 1980 | 26 | 0 |
| 1981 | 26 | 0 |
| 1982 | 25 | 0 |
| 1983 | 35 | 0 |
| 1984 | 35 | 0 |
| 1985 | 43 | 0 |
| 1986 | 69 | 0 |
| 1987 | 48 | 0 |
| 1988 | 70 | 0 |
| 1989 | 93 | 0 |
| 1990 | 45 | 0 |
| 1991 | 49 | 0 |
| 1992 | 50 | 0 |
| 1993 | 58 | 0 |
| 1994 | 47 | 0 |
| 1995 | 32 | 0 |
| 1996 | 47 | 0 |
| 1997 | 38 | 0 |
| 1998 | 61 | 0 |
| 1999 | 65 | 0 |
| 2000 | 78 | 0 |
| 2001 | 121 | 61 |
| 2002 | 91 | 139 |
| 2003 | 139 | 127 |
| 2004 | 107 | 127 |
| 2005 | 116 | 134 |
| 2006 | 129 | 126 |
| 2007 | 101 | 95 |
| 2008 | 66 | 111 |
| 2009 | 95 | 137 |
| 2010 | 95 | 123 |
| 2011 | 101 | 92 |
| 2012 | 121 | 95 |
| 2013 | 94 | 78 |
| 2014 | 96 | 65 |
| 2015 | 61 | 84 |
| 2016 | 42 | 29 |
| 2017 | 53 | 36 |
| 2018 | 47 | 31 |
| 2019 | 37 | 32 |
| 2020 | 37 | 27 |
| 2021 | 43 | 23 |
| 2022 | 25 | 17 |
| 2023 | 19 | 8 |
| 2024 | 16 | 5 |
| 2025 | 7 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Chip packaging apparatus and terminal device31 Mar 2026US 12,593,644 B2Huawei Technologies Co., Ltd.
- System for preparing component feed unit2 Sep 2025US 12,408,313 B2Fuji Corporation
- 3D system integration10 Jun 2025US 12,327,783 B2BroadPak Corporation
- Component mounting system13 May 2025US 12,302,503 B2Fuji Corporation
- Component mounter29 Apr 2025US 12,285,874 B2Fuji Corporation
- 2.5d/3d system integration28 Aug 2025US 2025/0273553 A1BroadPak Corporation
- Coil component5 Jun 2025US 2025/0182954 A1Murata Manufacturing Co., Ltd.
- Repair or refurbishment of limited use medical devices1 May 2025US 2025/0134503 A1Medline Industries, Inc.
- Apparatus and method for making a secured substrate24 Oct 2024US 2024/0355722 A1BroadPak Corporation
- Bonding temperature measurement device of display panel12 Sep 2024US 2024/0304655 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Three-dimensional multi-chip pad array carrier602US 5,222,014 AMotorola, Inc. · 1993
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Method of making a hybrid semiconductor device368US 4,818,728 ASharp Kabushiki Kaisha · 1989
- Method of assembling a wafer-level package filter288US 7,596,849 B1TriQuint Semiconductor, Inc. · 2009