Y10T 29/53178
Chip component
Y10T29/53178 (Chip component) appears on 1,608 US grants and 991 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,608
- Published applications
- 991
- Assignees
- 466
- Inventors
- 2,392
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 8 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 12 | 0 |
| 1985 | 12 | 0 |
| 1986 | 14 | 0 |
| 1987 | 18 | 0 |
| 1988 | 25 | 0 |
| 1989 | 46 | 0 |
| 1990 | 23 | 0 |
| 1991 | 31 | 0 |
| 1992 | 27 | 0 |
| 1993 | 35 | 0 |
| 1994 | 21 | 0 |
| 1995 | 19 | 0 |
| 1996 | 26 | 0 |
| 1997 | 25 | 0 |
| 1998 | 36 | 0 |
| 1999 | 46 | 0 |
| 2000 | 56 | 0 |
| 2001 | 95 | 48 |
| 2002 | 61 | 103 |
| 2003 | 101 | 81 |
| 2004 | 74 | 91 |
| 2005 | 91 | 93 |
| 2006 | 93 | 95 |
| 2007 | 70 | 63 |
| 2008 | 54 | 64 |
| 2009 | 68 | 74 |
| 2010 | 63 | 68 |
| 2011 | 58 | 48 |
| 2012 | 67 | 40 |
| 2013 | 43 | 22 |
| 2014 | 52 | 19 |
| 2015 | 20 | 31 |
| 2016 | 12 | 3 |
| 2017 | 20 | 7 |
| 2018 | 11 | 6 |
| 2019 | 8 | 6 |
| 2020 | 9 | 8 |
| 2021 | 8 | 8 |
| 2022 | 7 | 5 |
| 2023 | 5 | 3 |
| 2024 | 5 | 3 |
| 2025 | 4 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip packaging apparatus and terminal device31 Mar 2026US 12,593,644 B2Huawei Technologies Co., Ltd.
- System for preparing component feed unit2 Sep 2025US 12,408,313 B2Fuji Corporation
- 3D system integration10 Jun 2025US 12,327,783 B2BroadPak Corporation
- Coil component18 Mar 2025US 12,255,007 B2Murata Manufacturing Co., Ltd.
- Secure semiconductor integration and method for making thereof18 Mar 2025US 12,255,189 B2BroadPak Corporation
- 2.5d/3d system integration28 Aug 2025US 2025/0273553 A1BroadPak Corporation
- Coil component5 Jun 2025US 2025/0182954 A1Murata Manufacturing Co., Ltd.
- Apparatus and method for making a secured substrate24 Oct 2024US 2024/0355722 A1BroadPak Corporation
- 3d system integration18 Apr 2024US 2024/0128238 A1BroadPak Corporation
- Coil component7 Mar 2024US 2024/0079178 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Fabrication of reading or writing bar arrays assembled from subunits244US 5,221,397 AXerox Corporation · 1993
- Semiconductor interposer integration241US 9,893,004 B2BroadPak Corporation · 2018
- Physically highly secure multi-chip assembly225US 7,402,442 B2International Business Machines Corporation · 2008
- Stacking integrated circuits containing serializer and deserializer blocks using through silicon via210US 8,014,166 B2BroadPak Corporation · 2011