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US 12,255,189 B2Granted
Secure semiconductor integration and method for making thereof
AssigneeBroadPak Corporation
InventorFarhang Yazdani
Life of this patent
Estimating the term…
Abstract
An integrated circuit package comprising a heat spreader; one or more substrate(s); one or more standoff(s); and one or more electronic component(s). One or more component(s) is/are coupled to a substrate and the substrate maybe coupled to a heat spreader. Standoff(s) are coupled on the heat spreader or substrates forming a cavity, and one or more component(s) and substrate(s) are located inside the cavity.
Claims20
An integrated circuit package comprising:
- a non-cavity, fully planar heat spreader, wherein
- the non-cavity, fully planar heat spreader having no protrusions,
- said non-cavity, fully planar heat spreader including at least a first non-cavity, fully planar heat spreader surface and a second non-cavity, fully planar heat spreader surface;
- one or more substrate(s), wherein
- said one or more substrate(s) including at least a first substrate surface and a second substrate surface;
- one or more standoff(s) substrate(s), wherein
- said standoff substrate is a passive substrate;
- and
- one or more component(s), wherein
- said one or more component(s) is/are directly mounted and attached on said first substrate surface of said one or more substrate(s),
- said second substrate surface of said one or more substrate(s) is/are directly mounted and attached on said first non-cavity, fully planar heat spreader surface of said non-cavity, fully planar heat spreader,
- said one or more standoff(s) substrate(s) is/are directly mounted and attached on said first non-cavity, fully planar heat spreader surface of said non-cavity, fully planar heat spreader forming one or more cavity(ies)/clearance(s), and
- said one or more component(s) and said one or more substrate(s) are located inside said one or more cavity(ies)/clearance(s).
10 more elements
An integrated circuit package comprising:
- one or more non-cavity, fully planar heat spreader(s), wherein
- the one or more non-cavity, fully planar heat spreader having no protrusions;
- one or more standoff(s) substrate(s), wherein
- said standoff substrate is a passive substrate;
- one or more component(s), wherein
- said one or more component(s) including a first component and a second component;
- one or more substrate(s), wherein
- said one or more substrate(s) including a first substrate and a second substrate, wherein
- said one or more standoff(s) substrate(s) is/are directly mounted and attached on said first substrate and said second substrate, forming one or more cavity(ies)/clearance(s), said first component of said one or more component(s) is/are only directly mounted and attached to said first substrate, and located inside said one or more cavity(ies)/clearance(s),
- said one or more non-cavity, fully planar heat spreader(s) is/are directly mounted and attached to said one or more component(s) and/or said one or more substrate(s),
- said second component is directly mounted and attached to both said first substrate and said second substrate, and located inside said one or more cavity(ies)/clearance(s).
8 more elements
An integrated circuit package comprising:
- one or more non-cavity, fully planar heat spreader(s), wherein
- the one or more non-cavity, fully planar heat spreader having no protrusions;
- one or more standoff(s) substrate(s), wherein
- said standoff substrate is a passive substrate;
- one or more component(s), wherein
- said one or more component(s) including a first component and a second component;
- one or more substrate(s), wherein
- said one or more substrate(s) including a first substrate and a second substrate, wherein
- said one or more standoff(s) substrate(s) is/are directly mounted and attached on said first substrate and said second substrate, forming one or more cavity(ies)/clearance(s),
- said first component of said one or more component(s) is/are directly mounted and attached to both said first substrate, and said second substrate and located inside said one or more cavity(ies)/clearance(s),
- said one or more non-cavity, fully planar heat spreader(s) is/are directly mounted and attached to said one or more component(s) and/or said one or more substrate(s), and
- said second component is directly mounted and attached to both said first substrate and said second substrate, and located inside said one or more cavity(ies)/clearance(s).
9 more elements
Dependencies are inferred from the claim text.