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US 12,327,783 B2Granted
3D system integration
AssigneeBroadPak Corporation
InventorFarhang Yazdani
Life of this patent
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Abstract
Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.
Claims11
A system comprising:
- a first die comprising first Ser/Des IO(s);
- a second die comprising Through Die Via, said first Ser/Des IO(s), and a second Ser/des IO(s);
- a third die comprising said second Ser/Des IO(s),
- a substrate, wherein
- said substrate comprising vias and redistribution layers,
- said first die is stacked on said second die,
- said second die and said third die are stacked on said substrate,
- said first die and said first Ser/Des IO(s) are configured to communicate with said second die and first Ser/Des IO(s);
- and
- said second die and second Ser/Des IO(s) are configured to communicate with said third die and second Ser/Des IO(s).
7 more elements
Dependencies are inferred from the claim text.