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US 2025/0273553 A1Published application
2.5d/3d system integration
AssigneeBroadPak Corporation
InventorFarhang YAZDANI
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Abstract
Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.
Claims13
A system comprising:
- a first die comprising first parallel IO(s);
- a second die comprising Through Die Via, said first parallel IO(s), and a first Ser/des IO(s);
- a third die comprising said first Ser/Des IO(s),
- a substrate, wherein
- said substrate comprising vias and redistribution layers,
- said first die is stacked on said second die,
- said second die and said third die are stacked on said substrate,
- said first die and said first parallel IO(s) are configured to communicate with said second die first parallel IO(s);
- and
- said second die said first Ser/Des IO(s) are configured to communicate with said third die said first Ser/Des IO(s).
7 more elements
Dependencies are inferred from the claim text.