3d heterogeneous integrations and methods of making thereof

An integrated circuit package comprising:

• one or more component(s);
• and
• one or more substrate(s), wherein
• said one or more substrate(s) including a first substrate and a second substrate,
• said first substrate including a first surface of said first substrate and a second surface of said first substrate,
• said second substrate including a first surface of said second substrate and a second surface of said second substrate,
• said first substrate including a first first-substrate cavity on the first surface of said first substrate,
• said second substrate includes a first second-substrate cavity on the first surface of said second substrate,
• said first surface of said first substrate and the first surface of said second substrate is located between said second surface of said first substrate and said second surface of said second substrate, and
• said one or more component(s) is/are disposed inside said first first-substrate cavity of first substrate and/or said first second-substrate cavity of second substrate.

An integrated circuit package comprising:

• one or more component(s);
• and
• one or more substrate(s), wherein
• said one or more substrate(s) including a first substrate, a second substrate and a third substrate, wherein
• said first substrate including a first surface of said first substrate and a second surface of said first substrate,
• said second substrate including a first surface of said second substrate and a second surface of said second substrate,
• said first substrate including a first first-substrate cavity on the first surface of said first substrate,
• said second substrate includes a first second-substrate cavity on the first surface of said second substrate,
• said first surface of said first substrate and the first surface of said second substrate is located between said second surface of said first substrate and said second surface of said second substrate,
• said third substrate is coupled to said first substrate and/or said second substrate, and
• said one or more component(s) is/are disposed inside said first first-substrate cavity of first substrate and/or said first second-substrate cavity of second substrate.