Y10T 29/49165
By forming conductive walled aperture in base
Official title: by forming conductive walled aperture in base
Y10T29/49165 (By forming conductive walled aperture in base) appears on 3,257 US grants and 2,802 published applications in this corpus.
Search patents in Y10T- Granted patents
- 3,257
- Published applications
- 2,802
- Assignees
- 889
- Inventors
- 4,907
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 8 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 12 | 0 |
| 1986 | 15 | 0 |
| 1987 | 22 | 0 |
| 1988 | 16 | 0 |
| 1989 | 29 | 0 |
| 1990 | 23 | 0 |
| 1991 | 23 | 0 |
| 1992 | 22 | 0 |
| 1993 | 24 | 0 |
| 1994 | 42 | 0 |
| 1995 | 33 | 0 |
| 1996 | 46 | 0 |
| 1997 | 45 | 0 |
| 1998 | 56 | 0 |
| 1999 | 57 | 0 |
| 2000 | 60 | 0 |
| 2001 | 102 | 81 |
| 2002 | 113 | 156 |
| 2003 | 147 | 163 |
| 2004 | 178 | 201 |
| 2005 | 118 | 175 |
| 2006 | 138 | 184 |
| 2007 | 164 | 185 |
| 2008 | 142 | 275 |
| 2009 | 138 | 225 |
| 2010 | 165 | 186 |
| 2011 | 204 | 209 |
| 2012 | 242 | 198 |
| 2013 | 189 | 137 |
| 2014 | 172 | 133 |
| 2015 | 124 | 117 |
| 2016 | 103 | 29 |
| 2017 | 68 | 37 |
| 2018 | 52 | 31 |
| 2019 | 43 | 31 |
| 2020 | 32 | 16 |
| 2021 | 12 | 10 |
| 2022 | 14 | 9 |
| 2023 | 5 | 6 |
| 2024 | 8 | 4 |
| 2025 | 5 | 1 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Methods of manufacture of multi-diameter female contacts with a circuit board30 Jun 2026US 12,672,242 B2Eagle Technology, LLC
- Manufacturing method of electronic device28 Oct 2025US 12,457,005 B2Innolux Corporation
- Manufacturing method of package structure9 Sep 2025US 12,414,243 B2Unimicron Technology Corp.
- Interconnect structure having conductor extending along dielectric block4 Mar 2025US 12,245,361 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Circuit board manufacturing system and method17 Sep 2026US 2026/0282242 A1Ufab Corporation
- Electronic device8 Jan 2026US 2026/0012221 A1Innolux Corporation
- Method for forming circuit board17 Apr 2025US 2025/0126723 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 3dic package with interposer formed by spin on process28 Nov 2024US 2024/0395684 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structures and methods for integration of ultralow-k dielectrics with improved reliability554US 7,088,003 B2International Business Machines Corporation · 2006
- Substrate supporting apparatus529US 7,503,980 B2NHK Spring Co., Ltd. · 2009
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999