Y10T 29/49167
With deforming of conductive path
Official title: with deforming of conductive path
Y10T29/49167 (With deforming of conductive path) appears on 212 US grants and 146 published applications in this corpus.
Search patents in Y10T- Granted patents
- 212
- Published applications
- 146
- Assignees
- 100
- Inventors
- 324
- Latest grant
- 20 Oct 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 7 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 4 |
| 2002 | 5 | 9 |
| 2003 | 7 | 10 |
| 2004 | 15 | 18 |
| 2005 | 12 | 7 |
| 2006 | 7 | 10 |
| 2007 | 10 | 16 |
| 2008 | 16 | 8 |
| 2009 | 5 | 6 |
| 2010 | 8 | 5 |
| 2011 | 9 | 10 |
| 2012 | 16 | 10 |
| 2013 | 9 | 8 |
| 2014 | 4 | 4 |
| 2015 | 11 | 13 |
| 2016 | 7 | 4 |
| 2017 | 6 | 2 |
| 2018 | 4 | 1 |
| 2019 | 3 | 1 |
| 2020 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for packaging circuits20 Oct 2020US 10,811,278 B2Micron Technology, Inc.
- Method of producing a liquid cooled coldplate7 Jan 2020US 10,531,594 B2Wieland Microcool, LLC
- Manufacturing method for camera module12 Nov 2019US 10,477,084 B2Murata Manufacturing Co., Ltd.
- Method for packaging circuits22 Oct 2019US 10,453,704 B2Micron Technology, Inc.
- Fabrication method of circuit structure5 Feb 2019US 10,201,090 B2Siliconware Precision Industries Co., Ltd.
- Method for packaging circuits28 Nov 2019US 2019/0362988 A1Micron Technology, Inc.
- Method of Producing a Liquid Cooled Coldplate8 Feb 2018US 2018/0042137 A1Wolverine Tube, Inc.
- Fabrication method of circuit structure21 Sep 2017US 2017/0273185 A1Siliconware Precision Industries Co., Ltd.
- Method for packaging circuits16 Feb 2017US 2017/0047231 A1Micron Technology, Inc.
- Liquid cooled coldplate17 Nov 2016US 2016/0338222 A1Wolverine Tube, Inc.
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005
- Electronic component and method of packaging168US 5,661,088 AMotorola, Inc. · 1997
- Process for manufacturing a printed wiring board107US 6,775,907 B1International Business Machines Corporation · 2004