Electronic component and method of packaging

A method of manufacturing an electronic component, the method comprising:

• providing a substrate having a hole extending from a first surface of the substrate to a second surface of the substrate;
• disposing a malleable layer overlying the first surface of the substrate and overlying the hole;
• disposing an electrically conductive layer in the hole prior to deforming the malleable layer, the electrically conductive layer disposed to be electrically coupled to the malleable layer;
• deforming the malleable layer into the hole, the malleable layer extending from the first surface of the substrate toward the second surface of the substrate and the malleable layer remaining continuous in the hole;
• and
• selecting the malleable layer from the group consisting of copper, gold, or aluminum, wherein a portion of the hole is exposed along the first surface of the substrate.

A method of fabricating an electronic component, the method comprising the steps of:

• providing a substrate having a first surface opposite a second surface;
• forming a hole in the substrate;
• adhering a metallic film to the first surface of the substrate, the metallic film having a third surface facing away from the substrate and a fourth surface opposite the third surface and facing towards the substrate, the fourth surface having a first portion exposed by the hole in the substrate;
• patterning the metallic film;
• pushing the metallic film into the hole in the substrate, wherein the metallic film forms a dimple in the hole, the third surface of the metallic film having a second portion remaining over a portion of the first surface of the substrate;
• coupling a semiconductor die to the second portion of the third surface of the metallic film, the semiconductor die overlying the first surface of the substrate;
• and
• disposing an underencapsulant in the dimple and between the semiconductor die and the substrate.

A method of manufacturing an electronic component, the method comprising:

• providing a substrate having a hole extending from a first surface of the substrate to a second surface of the substrate;
• disposing a malleable layer overlying the first surface of the substrate and overlying the hole;
• disposing an electrically conductive layer in the hole prior to deforming the malleable layer, the electrically conductive layer disposed to be electrically coupled to the malleable layer;
• deforming the malleable layer into the hole, the malleable layer extending from the first surface of the substrate toward the second surface of the substrate and the malleable layer remaining continuous in the hole;
• and
• disposing an electrically insulating material in the hole after deforming the malleable layer into the hole.

A method of fabricating an electronic component, the method comprising the steps of:

• providing a substrate having a first surface opposite a second surface;
• forming a hole in the substrate;
• adhering a metallic film to the first surface of the substrate, the metallic film having a third surface facing away from the substrate and a fourth surface opposite the third surface and facing towards the substrate, the fourth surface having a first portion exposed by the hole in the substrate;
• patterning the metallic film;
• pushing the metallic film into the hole in the substrate, wherein the metallic film forms a dimple in the hole, the third surface of the metallic film having a second portion remaining over a portion of the first surface of the substrate;
• coupling a semiconductor die to the second portion of the third surface of the metallic film, the semiconductor die overlying the first surface of the substrate;
• and
• disposing an underencapsulant overlying the dimple and between the semiconductor die and the substrate, wherein the step of disposing the underencapsulant includes disposing the underencapsulant in the hole.