Manufacturing method for camera module

A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween, the manufacturing method comprising:

• a first step of forming the multilayer body which includes a cavity by stacking and combining a plurality of first members;
• a second step of forming a through hole in the plurality of first members that constitute at least a portion of the multilayer body from the cavity to form the optical path defined by the through hole;
• and
• a third step of mounting the image sensor IC and the lens with the through hole being disposed therebetween;
• wherein
• the cavity is opened inward from a first surface of the multilayer body in a stacking direction;
• the through hole extends from a bottom surface of the cavity to a second surface of the multilayer body in the stacking direction;
• and
• in the second step, the second surface of the multilayer body is set in contact with a flat or substantially flat working surface, and the through hole is formed from a side of the first surface of the multilayer body.