Fabrication method of circuit structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsShao-Tzu Tang, Ying-Chou Tsai
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Abstract
A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.
Claims11
1-9. (canceled)
A method for fabricating a circuit structure, comprising the steps of:
- forming a plurality of first conductive pads on a carrier, wherein a length of each of the first conductive pads is greater than a width of the first conductive pad;
- forming a plurality of conductive posts on the first conductive pads, wherein each of the conductive posts has opposite first and second end surfaces and the first conductive pads are bonded to the first end surfaces of the conductive posts;
- and
- forming a plurality of second conductive pads on the second end surfaces of the conductive posts.
Dependencies are inferred from the claim text.