Interconnect structure having conductor extending along dielectric block
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun-Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh
Life of this patent
Estimating the term…
Abstract
An interconnect structure includes a dielectric block, a first conductive plug, a second conductive plug, a substrate, a first conductive line, and a second conductive line. The first conductive plug and the second conductive plug are surrounded by the dielectric block. The substrate surrounds the dielectric block. The first conductive line is connected to the first conductive plug and is in contact with a top surface of the dielectric block. The second conductive line is connected to the second conductive plug.
Claims20
An interconnect structure comprising:
- a dielectric block;
- a first conductive plug and a second conductive plug surrounded by the dielectric block;
- a substrate surrounding the dielectric block;
- a first conductive line connected to the first conductive plug and in contact with a top surface of the dielectric block;
- a second conductive line connected to the second conductive plug;
- and
- a first conductor within the dielectric block, wherein the first conductor laterally surrounds the first conductive plug and is interposed between the dielectric block and the first conductive plug, and the first conductor is formed of a different material than the first conductive plug.
An interconnect structure comprising:
- a substrate being a single piece of continuous material;
- a dielectric block embedded in the substrate, wherein the dielectric block and the substrate have substantially the same vertical thickness;
- a first conductor and a second conductor surrounded by the dielectric block, wherein the first conductor has an upper portion protruding from a top surface of the dielectric block, and the top surface of the dielectric block is exposed from the upper portion of the first conductor;
- and
- a first conductive line and a second conductive line connected to the first conductor and the second conductor, respectively.
An interconnect structure comprising:
- a first conductor and a second conductor;
- a dielectric block surrounding the first conductor and the second conductor, wherein from a cross-sectional view, the first conductor has an upper portion protruding from a top surface of the dielectric block, and the top surface of the dielectric block is exposed from the upper portion of the first conductor;
- a substrate surrounding the dielectric block;
- a first pad covering the first conductor;
- a third conductor over the first pad, wherein from the cross-sectional view a lateral dimension of the third conductor is less than a lateral dimension of the first pad;
- and
- a dielectric layer covering the dielectric block and the substrate, wherein the first pad and the third conductor are embedded in the dielectric layer.
Dependencies are inferred from the claim text.