H10W 80/338
Using em radiation or electron beams
Official title: {using EM radiation or electron beams, e.g. using lasers}
H10W80/338 (Using em radiation or electron beams) appears on 30 US grants and 47 published applications in this corpus.
Search patents in H10W- Granted patents
- 30
- Published applications
- 47
- Assignees
- 34
- Inventors
- 104
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 2 |
| 2014 | 0 | 0 |
| 2015 | 5 | 3 |
| 2016 | 1 | 2 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 3 | 2 |
| 2020 | 0 | 1 |
| 2021 | 3 | 4 |
| 2022 | 4 | 4 |
| 2023 | 3 | 4 |
| 2024 | 4 | 13 |
| 2025 | 3 | 3 |
| 2026 | 2 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a semiconductor device21 Jul 2026US 12,690,491 B2Samsung Electronics Co., Ltd.
- Bonding layer and process5 May 2026US 12,622,336 B2Tokyo Electron Limited
- Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same9 Sep 2025US 12,412,871 B2Samsung Electronics Co., Ltd.
- Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods22 Jul 2025US 12,368,131 B2Micron Technology, Inc.
- Method for transferring electronic device11 Feb 2025US 12,224,263 B2Micraft System Plus Co., Ltd.
- Semiconductor device including laser beam absorption enhancement structures and methods for forming the same1 Oct 2026US 2026/0304792 A1SanDisk Technologies LLC
- Bonding layer and process13 Aug 2026US 2026/0240057 A1Tokyo Electron Limited
- Structures and methods for local heating of hybrid bonding contact16 Jul 2026US 2026/0206661 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same27 Nov 2025US 2025/0364499 A1Samsung Electronics Co., Ltd.
- Method for bonding electronics structures during integrated electronics manufacturing16 Oct 2025US 2025/0323207 A1PulseForge Inc.
Most cited
By later US patents
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Electrically bonded arrays of transfer printed active components67US 9,049,797 B2Semprius, Inc. · 2015
- Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer27US 9,142,532 B2Bondtech Co., Ltd. · 2015
- Laser assisted transfer welding process11US 10,181,483 B22019
- Semiconductor-on-insulator with back side heat dissipation10US 9,029,201 B2Silanna Semiconductor U.S.A., Inc. · 2015