Back to results
US 12,622,336 B2Granted
Bonding layer and process
AssigneeTokyo Electron Limited
InventorsScott Lefevre, Adam Gildea, Satohiko Hoshino, Sophia Madelone, Yuji Mimura
Life of this patent
Estimating the term…
Abstract
A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second substrate. The method includes bonding the first substrate to the second substrate by making physical contact between the first bonding surface and second bonding surface. The method further includes applying thermal energy or light to the bonding layer.
Claims19
A method, comprising:
- providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable;
- providing a second bonding surface on a second substrate;
- bonding the first substrate to the second substrate by making physical contact between the first bonding surface and the second bonding surface;
- and
- applying thermal energy or light to the bonding layer,
- wherein applying the thermal energy or the light covalently bonds the bonding layer to the first substrate at the first bonding surface and to the second substrate at the second bonding surface, respectively.
3 more elements
A method, comprising:
- providing a first bonding surface on a first substrate, the first bonding surface including a first bonding layer that is thermally curable or photocurable;
- providing a second bonding surface on a second substrate, the second bonding surface including a second bonding layer;
- bonding the first substrate to the second substrate by making physical contact between the first bonding layer and the second bonding layer;
- and
- applying thermal energy or light to the first bonding layer and the second bonding layer.
2 more elements
A semiconductor structure, comprising:
- a first substrate;
- a second substrate;
- and
- a bonding layer bonding the first substrate to the second substrate, the bonding layer including a polymer-based material that includes carbosilane linkages.
1 more element
Dependencies are inferred from the claim text.