H10W 80/211
Direct bonding of chips, wafers or substrates: using auxiliary members
Official title: {using auxiliary members, e.g. aids for protecting the bonding area}
H10W80/211 (Direct bonding of chips, wafers or substrates: using auxiliary members) appears on 620 US grants and 935 published applications in this corpus.
Search patents in H10W- Granted patents
- 620
- Published applications
- 935
- Assignees
- 162
- Inventors
- 1,281
- Latest grant
- 29 Sep 2026
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|---|---|---|
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| 2025 | 91 | 129 |
| 2026 | 53 | 79 |
By publication year. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014