H10W 72/328
Multiple die-attach connectors having different structures
Official title: {Multiple die-attach connectors having different structures}
H10W72/328 (Multiple die-attach connectors having different structures) appears on 23 US grants and 30 published applications in this corpus.
Search patents in H10W- Granted patents
- 23
- Published applications
- 30
- Assignees
- 20
- Inventors
- 52
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 3 | 3 |
| 2016 | 0 | 4 |
| 2017 | 2 | 1 |
| 2018 | 4 | 8 |
| 2019 | 1 | 0 |
| 2020 | 4 | 0 |
| 2021 | 2 | 4 |
| 2022 | 2 | 3 |
| 2023 | 1 | 3 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof10US 9,111,870 B2Freescale Semiconductor, Inc. · 2015
- Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment8US 7,811,863 B1Bridge Semiconductor Corporation · 2010
- Semiconductor package including stacked memory chips5US 9,214,441 B2Samsung Electronics Co., Ltd. · 2015
- Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same3US 9,190,381 B2Dexerials Corporation · 2015
- Package substrate and manufacturing method thereof and package3US 9,991,222 B2Winbound Electronics Corp. · 2018