Semiconductor structure and manufacturing method thereof
AssigneeChangxin Memory Technologies, Inc.
InventorMingxing Zuo
Life of this patent
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Abstract
The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, a die and a first adhesive layer; a surface of the substrate is provided with an insulation layer; the die is arranged on a surface of the insulation layer via the first adhesive layer; the insulation layer is provided with at least one slot; a position of the at least one slot corresponds to at least a part of an edge of the first adhesive layer; a second adhesive layer is arranged in the at least one slot; at least a part of a surface of the second adhesive layer is connected with the first adhesive layer; and an elasticity modulus of the second adhesive layer is smaller than an elasticity modulus of the first adhesive layer.
Claims19
A semiconductor structure, comprising a substrate, a die and a first adhesive layer, wherein a surface of the substrate is provided with an insulation layer;
- the die is arranged on a surface of the insulation layer via the first adhesive layer;
- the insulation layer is provided with at least one slot;
- a position of the at least one slot corresponds to at least a part of an edge of the first adhesive layer;
- a second adhesive layer is arranged in the at least one slot;
- at least a part of a surface of the second adhesive layer is connected with the first adhesive layer;
- and
- an elasticity modulus of the second adhesive layer is smaller than an elasticity modulus of the first adhesive layer.
A method of manufacturing a semiconductor structure, comprising:
- providing a substrate, wherein a surface of the substrate is provided with an insulation layer;
- forming at least one slot which runs through the insulation layer on the insulation layer;
- forming a second adhesive layer in the at least one slot;
- arranging a die on a surface of the insulation layer via a first adhesive layer, wherein a position of the at least one slot corresponds to at least a part of an edge of the first adhesive layer, at least a part of a surface of the second adhesive layer is connected with the first adhesive layer, and an elasticity modulus of the second adhesive layer is smaller than an elasticity modulus of the first adhesive layer;
- and
- forming a packaging layer on the surface of the substrate, wherein each structure on the substrate is internally packaged in the packaging layer.
Dependencies are inferred from the claim text.