Package substrate and manufacturing method thereof and package
AssigneeWinbound Electronics Corp.
InventorYu-Ming Chen
Life of this patent
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Abstract
A package substrate including a carrier, a first patterned conductive layer, a second patterned conductive layer and a 3D-printing conductive wire is provided. The carrier has a first surface, a second surface and a third surface. The first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface. The second patterned conductive layer is disposed on the second surface. The 3D-printing conductive wire is disposed on the third surface and connected between the first patterned conductive layer and the second patterned conductive layer.
Claims10
A manufacturing method of a package substrate, comprising:
- providing a carrier having a first surface, a second surface and a third surface, wherein the first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface;
- forming a first patterned conductive layer on the first surface;
- forming a second patterned conductive layer on the second surface;
- and
- forming a 3D-printing conductive wire on the third surface by a 3D-printing method, wherein the 3D-printing conductive wire is connected between the first patterned conductive layer and the second patterned conductive layer.
Dependencies are inferred from the claim text.