Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same

An electronic component having an insulating adhesive member formed by adhering the insulating adhesive member on a side of an electronic component on which an electrode is formed,

• wherein the insulating adhesive member is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which contains no filler in an insulating adhesive composition, and the first insulating adhesive layer is adhered on the side of the electronic component on which an electrode is formed so as to be opposed to the electrode of the electronic component,
• wherein H/2<Tf<H≦Tf+Tn is satisfied, wherein H is the height of the electrode of the electronic component, Tf is the thickness of the first insulating adhesive layer, and Tn is the second insulating adhesive layer.

A method for manufacturing an electronic component having an insulating adhesive member formed by adhering an insulating adhesive member on a side of an electronic component on which an electrode is formed,

• wherein the insulating adhesive member is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which contains no filler in an insulating adhesive composition,
• wherein H/2<Tf<H≦Tf+Tn is satisfied, wherein H is the height of the electrode of the electronic component, Tf is the thickness of the first insulating adhesive layer, and Tn is the second insulating adhesive layer,
• wherein the insulating adhesive member is adhered on the side of the electronic component on which an electrode is formed such that the first insulating adhesive layer is opposed to the electrode of the electronic component.

An insulating adhesive member for connecting a side of a substrate on which an electrode is formed and a side of an electronic component on which an electrode is formed,

• wherein the insulating adhesive member is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and is adhered on the side of the electronic component on which an electrode is formed so as to be opposed to the electrode of the electronic component and a second insulating adhesive layer which contains no filler in an insulating adhesive composition, and
• wherein H/2<Tf<H≦Tf+Tn is satisfied, wherein H is the height of the electrode of the electronic component, Tf is the thickness of the first insulating adhesive layer, and Tn is the second insulating adhesive layer.

A connection structure formed by connection via a connection method for connecting a side of a substrate on which an electrode is formed and a side of an electronic component on which an electrode is formed via an insulating adhesive member,

• wherein the insulating adhesive member is formed by laminating a first insulating adhesive layer which contains a filler in a insulating adhesive composition and a second insulating adhesive layer which contains no filler in an insulating adhesive composition,
• wherein H/2<Tf<H≦Tf+Tn is satisfied, wherein H is the height of the electrode of the electronic component, Tf is the thickness of the first insulating adhesive layer, and Tn is the second insulating adhesive layer, and
• wherein the side of the substrate on which an electrode is formed and the side of the electronic component on which an electrode is formed are connected via the insulating adhesive member arranged such that the first insulating adhesive layer and the side of the electronic component on which an electrode is formed are opposed to thereby connect the electrode of the substrate and the electrode of the electronic component.