H10W 46/403
For non-wireless electrical read out
Official title: {for non-wireless electrical read out}
H10W46/403 (For non-wireless electrical read out) appears on 345 US grants and 314 published applications in this corpus.
Search patents in H10W- Granted patents
- 345
- Published applications
- 314
- Assignees
- 144
- Inventors
- 558
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 11 | 9 |
| 2002 | 22 | 25 |
| 2003 | 17 | 16 |
| 2004 | 19 | 22 |
| 2005 | 11 | 20 |
| 2006 | 21 | 22 |
| 2007 | 11 | 15 |
| 2008 | 8 | 17 |
| 2009 | 10 | 13 |
| 2010 | 21 | 15 |
| 2011 | 16 | 27 |
| 2012 | 9 | 4 |
| 2013 | 19 | 16 |
| 2014 | 15 | 12 |
| 2015 | 16 | 12 |
| 2016 | 6 | 9 |
| 2017 | 9 | 7 |
| 2018 | 12 | 13 |
| 2019 | 7 | 4 |
| 2020 | 7 | 10 |
| 2021 | 9 | 7 |
| 2022 | 4 | 6 |
| 2023 | 5 | 4 |
| 2024 | 7 | 5 |
| 2025 | 3 | 3 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and systems for creating electronic devices via maskless lithography2 Jun 2026US 12,648,451 B2ASML Netherlands B. V.
- Semiconductor device, electronic device, and method of setting characteristics of electronic device24 Jun 2025US 12,341,426 B2LAPIS Technology Co., Ltd.
- Physical unclonable function10 Jun 2025US 12,327,798 B2International Business Machines Corporation
- Optoelectronic component with two-dimensional code on its surface, system and method for producing same15 Apr 2025US 12,278,194 B2OSRAM Opto Semiconductors GmbH
- Semiconductor device and semiconductor device identification method24 Sep 2024US 12,100,714 B2Rohm Co., Ltd.
- Method of routing traces of an interconnect structure23 Apr 2026US 2026/0114291 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure for chip identification27 Nov 2025US 2025/0366198 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus, system, and method for uniquely identifying individual dies across die stacks26 Jun 2025US 2025/0210538 A1Advanced Micro Devices, Inc.
- Semiconductor device structure for chip identification13 Feb 2025US 2025/0056876 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Physical unclonable functions with copper-silicon oxide programmable metallization cells17 Oct 2024US 2024/0347480 A1
Most cited
By later US patents
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- System for providing an integrated circuit with a unique identification193US 6,161,213 AIcid, LLC · 2000
- Method for identifying a semiconductor die using an IC with programmable links127US 5,301,143 AMicron Semiconductor, Inc. · 1994
- Semiconductor device having identification region for carrying out failure analysis113US 5,294,812 AKabushiki Kaisha Toshiba · 1994
- Semiconductor integrated circuit chip having an identification circuit therein87US 5,103,166 ASamsung Electronics Co., Ltd. · 1992