H10W 46/401
Marks applied to devices: for identification or tracking
Official title: {for identification or tracking}
H10W46/401 (Marks applied to devices: for identification or tracking) appears on 1,086 US grants and 1,246 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,086
- Published applications
- 1,246
- Assignees
- 375
- Inventors
- 2,235
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 13 | 0 |
| 2000 | 15 | 0 |
| 2001 | 17 | 11 |
| 2002 | 24 | 32 |
| 2003 | 24 | 23 |
| 2004 | 28 | 31 |
| 2005 | 15 | 33 |
| 2006 | 28 | 40 |
| 2007 | 17 | 27 |
| 2008 | 15 | 34 |
| 2009 | 23 | 37 |
| 2010 | 40 | 39 |
| 2011 | 32 | 67 |
| 2012 | 26 | 36 |
| 2013 | 54 | 46 |
| 2014 | 41 | 44 |
| 2015 | 47 | 66 |
| 2016 | 47 | 73 |
| 2017 | 72 | 69 |
| 2018 | 62 | 78 |
| 2019 | 65 | 66 |
| 2020 | 65 | 73 |
| 2021 | 55 | 60 |
| 2022 | 45 | 57 |
| 2023 | 42 | 57 |
| 2024 | 50 | 58 |
| 2025 | 49 | 55 |
| 2026 | 30 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure including a package substrate and methods of forming the same6 Oct 2026US 12,757,773 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing silicon carbide substrate, silicon carbide single-crystal substrate and silicon carbide semiconductor device25 Aug 2026US 12,720,830 B2Denso Corporation
- Substrate barcode readability enhancement structures and method11 Aug 2026US 12,707,984 B2Infineon Technologies AG
- Method of marking semiconductor package4 Aug 2026US 12,702,018 B2Samsung Electronics Co., Ltd.
- Semiconductor package4 Aug 2026US 12,702,019 B2Samsung Electronics Co., Ltd.
- Semiconductor package with stacked members8 Oct 2026US 2026/0314415 A1Samsung Electronics Co., Ltd.
- Semiconductor package17 Sep 2026US 2026/0282939 A1Samsung Electronics Co., Ltd.
- Glass substrate for semiconductor and method for identifying glass substrate for semiconductor3 Sep 2026US 2026/0262507 A1AGC Inc.
- Marking method and semiconductor package27 Aug 2026US 2026/0255979 A1Kioxia Corporation
- Semiconductor package and method for fabricating the same13 Aug 2026US 2026/0239993 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- Semiconductor wafer edge marking561US 6,710,364 B2Texas Instruments Incorporated · 2004
- System for providing an integrated circuit with a unique identification193US 6,161,213 AIcid, LLC · 2000
- Method for identifying a semiconductor die using an IC with programmable links127US 5,301,143 AMicron Semiconductor, Inc. · 1994
- Semiconductor device having identification region for carrying out failure analysis113US 5,294,812 AKabushiki Kaisha Toshiba · 1994