Semiconductor device structure for chip identification
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo-Huan HSIN, Ying-Han CHIOU
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo-Huan HSIN, Ying-Han CHIOU
Estimating the term…
The present disclosure describes a semiconductor device having an identification device for chip identification. The semiconductor structure includes first and second channel structures on a substrate, a gate structure on the first and second channel structures, an epitaxial structure on the first and second channel structures, and a first source/drain (S/D) contact structure on the first channel structure. The epitaxial structure is at a first side of the gate structure and the first S/D contact structure is at a second side of the gate structure opposite to the first side. The semiconductor structure further includes a second S/D contact structure on the second channel structure. The second S/D contact structure is at the second side of the gate structure.
A semiconductor structure, comprising:
A semiconductor device, comprising:
A method, comprising:
Dependencies are inferred from the claim text.