H10P 72/145
Characterised by a material, a roughness, a coating or the like
Official title: {characterised by a material, a roughness, a coating or the like}
H10P72/145 (Characterised by a material, a roughness, a coating or the like) appears on 17 US grants and 30 published applications in this corpus.
Search patents in H10P- Granted patents
- 17
- Published applications
- 30
- Assignees
- 21
- Inventors
- 83
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 3 |
| 2006 | 0 | 2 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 1 |
| 2019 | 0 | 2 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 2 | 5 |
| 2024 | 0 | 4 |
| 2025 | 3 | 1 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Methods and systems having conductive polymer coating for electrostatic discharge applications2 Jun 2026US 12,648,398 B2Entegris, Inc.
- Substrate storage racks for semiconductor processing systems19 May 2026US 12,635,458 B2ASM IP Holding B. V.
- Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge24 Mar 2026US 12,588,463 B2STATS ChipPAC Pte. Ltd.
- Semiconductor substrate boat and methods of using the same20 May 2025US 12,308,266 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer18 Mar 2025US 12,255,091 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate support apparatus and method of manufacturing semiconductor device30 Apr 2026US 2026/0123352 A1Samsung Electronics Co., Ltd.
- Substrate storage racks for semiconductor processing systems15 Jan 2026US 2026/0018443 A1ASM IP Holding B. V.
- Substrate Transfer Module and Method for Manufacturing Substrate Transfer Module17 Jul 2025US 2025/0232994 A1Tokyo Electron Limited
- Semiconductor substrate boat and methods of using the same14 Nov 2024US 2024/0379394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge24 Oct 2024US 2024/0355655 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Heat treatment jig for silicon semiconductor substrate478US 7,210,925 B2Sumitomo Mitsubishi Silicon Corporation · 2007
- Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays7US 6,719,142 B1Ion Systems, Inc. · 2004
- Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems6US 7,771,563 B2Sumitomo Precision Products Co., Ltd. · 2010
- Container for precision substrate5US 7,781,035 B2Zeon Corporation · 2010
- Wafer loaders having buffer zones3US 9,502,274 B2Samsung Electronics Co., Ltd. · 2016