Methods and systems having conductive polymer coating for electrostatic discharge applications
AssigneeEntegris, Inc.
InventorsZhifeng Li, Pushkara Rao Varanasi, Michael C. Zabka
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Abstract
A semiconductor processing apparatus including: a substrate comprising a polymer material layer; and a conductive polymer coating layer that coats at least a portion of the polymer material layer of the substrate, wherein the conductive polymer coating layer comprises conjugated polymers, wherein the conductive polymer coating layer has a total extractable metals less than 400 ng/g, and wherein the conductive polymer coating layer is configured to discharge electrostatic buildup in the semiconductor processing apparatus when connected to a semiconductor processing system.
Claims14
A semiconductor processing apparatus comprising:
- a substrate comprising a polymer material layer;
- and
- a conductive polymer coating layer that coats at least a portion of the polymer material layer of the substrate,
- wherein the conductive polymer coating layer comprises conjugated polymers,
- wherein the conductive polymer coating layer has a total extractable metals of less than 400 ng/g and an outgassing level of less than 4 μg/g, and
- wherein the conductive polymer coating layer is configured to discharge electrostatic buildup in the semiconductor processing apparatus when connected to a semiconductor processing system.
Dependencies are inferred from the claim text.