Substrate support apparatus and method of manufacturing semiconductor device

A substrate support apparatus comprising:

• a lower support having a plate shape and having a first axis as a central axis extending in a vertical direction perpendicular to a horizontal plane of the lower support;
• an upper support on the lower support;
• and
• a connector connecting the lower support to the upper support,
• wherein the connector includes:
• a connection pillar extending parallel to the first axis;
• and
• at least one substrate support extending from the connection pillar toward the first axis, and
• wherein each of the at least one substrate support includes at least one first groove recessed from a lower surface of the at least one substrate support toward an upper surface of the at least one substrate support.

A substrate support apparatus comprising:

• a lower support having a plate shape and having a first axis as a central axis extending in a vertical direction perpendicular to a horizontal plane of the lower support;
• an upper support on the lower support;
• and
• a connector connecting the lower support to the upper support,
• wherein the connector includes:
• a connection pillar extending parallel to the first axis;
• and
• at least one substrate support extending from the connection pillar toward the first axis, and
• wherein the connection pillar includes a groove recessed from an inner surface of the connection pillar toward an outer surface of the connection pillar.