H10P 72/0448
Apparatus for applying a liquid, a resin, an ink or the like
Official title: {Apparatus for applying a liquid, a resin, an ink or the like}
H10P72/0448 (Apparatus for applying a liquid, a resin, an ink or the like) appears on 2,316 US grants and 2,600 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,316
- Published applications
- 2,600
- Assignees
- 564
- Inventors
- 4,434
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 1 | 0 |
| 1991 | 8 | 0 |
| 1992 | 17 | 0 |
| 1993 | 12 | 0 |
| 1994 | 15 | 0 |
| 1995 | 18 | 0 |
| 1996 | 16 | 0 |
| 1997 | 18 | 0 |
| 1998 | 35 | 0 |
| 1999 | 51 | 0 |
| 2000 | 66 | 0 |
| 2001 | 68 | 44 |
| 2002 | 73 | 88 |
| 2003 | 78 | 70 |
| 2004 | 73 | 103 |
| 2005 | 52 | 80 |
| 2006 | 40 | 101 |
| 2007 | 40 | 106 |
| 2008 | 36 | 81 |
| 2009 | 49 | 86 |
| 2010 | 86 | 99 |
| 2011 | 65 | 77 |
| 2012 | 60 | 82 |
| 2013 | 92 | 121 |
| 2014 | 72 | 98 |
| 2015 | 71 | 111 |
| 2016 | 72 | 87 |
| 2017 | 90 | 80 |
| 2018 | 75 | 118 |
| 2019 | 83 | 137 |
| 2020 | 132 | 158 |
| 2021 | 106 | 155 |
| 2022 | 104 | 127 |
| 2023 | 115 | 145 |
| 2024 | 101 | 114 |
| 2025 | 110 | 71 |
| 2026 | 77 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Storage and transfer module and substrate treatment apparatus including storage and transfer module29 Sep 2026US 12,748,355 B2Semes Co., Ltd.
- Apparatus and method for dispensing treatment liquid29 Sep 2026US 12,751,239 B2Semes Co., Ltd.
- Apparatus and methods for exhaust cleaning22 Sep 2026US 12,741,299 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method22 Sep 2026US 12,745,590 B2Tokyo Electron Limited
- Substrate treating apparatus and substrate treating method8 Sep 2026US 12,733,428 B2SCREEN Holdings Co., Ltd.
- Resist pump buffer tank and method of resist defect reduction8 Oct 2026US 2026/0310083 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate production method and substrate production apparatus8 Oct 2026US 2026/0314304 A1Ebara Corporation
- Substrate processing apparatus8 Oct 2026US 2026/0314305 A1Ebara Corporation
- Systems and methods for shuttered wafer cleaning8 Oct 2026US 2026/0314306 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus1 Oct 2026US 2026/0305229 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Radial jaw biopsy forceps1,155US 6,024,708 ASymbiosis Corporation · 2000
- UV light irradiating apparatus with liquid filter510US 7,763,869 B2ASM Japan K .K. · 2010
- Film forming method, computer storage medium, and film forming system471US 9,741,559 B2Tokyo Electron Limited · 2017
- Substrate processing method and computer storage medium470US 8,084,372 B2Tokyo Electron Limited · 2011
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995