H10P 72/0441
Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Official title: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like}
H10P72/0441 (Apparatus for sealing, encapsulating, glassing, decapsulating or the like) appears on 1,298 US grants and 1,494 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,298
- Published applications
- 1,494
- Assignees
- 476
- Inventors
- 3,237
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 9 | 0 |
| 1990 | 9 | 0 |
| 1991 | 7 | 0 |
| 1992 | 17 | 0 |
| 1993 | 11 | 0 |
| 1994 | 19 | 0 |
| 1995 | 15 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 12 | 0 |
| 1999 | 16 | 0 |
| 2000 | 20 | 0 |
| 2001 | 38 | 17 |
| 2002 | 41 | 42 |
| 2003 | 46 | 54 |
| 2004 | 30 | 58 |
| 2005 | 40 | 62 |
| 2006 | 31 | 59 |
| 2007 | 19 | 44 |
| 2008 | 27 | 42 |
| 2009 | 26 | 57 |
| 2010 | 44 | 44 |
| 2011 | 30 | 36 |
| 2012 | 36 | 39 |
| 2013 | 20 | 37 |
| 2014 | 38 | 32 |
| 2015 | 30 | 60 |
| 2016 | 37 | 57 |
| 2017 | 44 | 52 |
| 2018 | 44 | 76 |
| 2019 | 58 | 89 |
| 2020 | 69 | 83 |
| 2021 | 60 | 95 |
| 2022 | 67 | 92 |
| 2023 | 63 | 76 |
| 2024 | 68 | 59 |
| 2025 | 65 | 84 |
| 2026 | 32 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device for removing void in underfill material29 Sep 2026US 12,751,238 B2Samsung Electronics Co., Ltd.
- Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatus22 Sep 2026US 12,741,402 B2Towa Corporation
- Substrate processing apparatus and substrate processing method25 Aug 2026US 12,721,083 B2Tokyo Electron Limited
- Semiconductor high pressure annealing device25 Aug 2026US 12,721,088 B2Tokyo Electron Limited
- Apparatuses and methods for reducing particle contamination of wafers during transfer18 Aug 2026US 12,710,702 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sealing resin formation device1 Oct 2026US 2026/0305227 A1Yamaha Robotics Co., Ltd.
- Systems and Methods for Encapsulation of Semiconductor Devices1 Oct 2026US 2026/0305446 A1SanDisk Technologies LLC
- Multl-station tool with rotatable top plate assembly10 Sep 2026US 2026/0271672 A1Lam Research Corporation
- Sealing methods and apparatuses6 Aug 2026US 2026/0231720 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for porous tool23 Jul 2026US 2026/0215203 A1IQE plc
Most cited
By later US patents
- Radial jaw biopsy forceps1,155US 6,024,708 ASymbiosis Corporation · 2000
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Semiconductor processing system with gas curtain612US 5,997,588 AAdvanced Semiconductor Materials America, Inc. · 1999
- ALD apparatus and method556US 6,911,092 B2Sundew Technologies, LLC · 2005
- Thermal process station with heated lid553US 6,884,066 B2FSI International, Inc. · 2005