US 2026/0305446 A1 · Systems and Methods for Encapsulation of Semiconductor Devices

Abstract

A semiconductor device encapsulation system includes a mold cavity that receives a molding compound. A heating apparatus is coupled to the mold cavity and heats the molding compound received therein. An integrated physical pre-treatment device is coupled to the mold cavity and removes at least a portion of bubbles formed in the molding compound that is received within the mold cavity. The integrated physical pre-treatment device may reduce the risk of defects occurring during the encapsulation of a semiconductor device in the molding compound.

Claims20

Dependent claims

A method of encapsulating a semiconductor device, the method comprising:

dispensing a molding compound into a mold cavity;
forming bubbles within the molding compound by heating the molding compound in the mold cavity;
removing at least a portion of the bubbles from the molding compound during and/or after heating the molding compound by subjecting the molding compound to an integrated physical pre-treatment in the mold cavity;
and
after subjecting the molding compound to the integrated physical pre-treatment, positioning a semiconductor device within the mold cavity such that one or more components thereof are immersed in the molding compound.

2 more elements

Dependencies are inferred from the claim text.

Systems and Methods for Encapsulation of Semiconductor Devices

Life of this patent

Systems and Methods for Encapsulation of Semiconductor Devices

Life of this patent

Abstract

Claims20