Apparatuses and methods for reducing particle contamination of wafers during transfer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsZheng-Hao Zhang, Hsin Yi Tseng, Chueh-Chi Kuo, Li-Jui Chen, Heng-Hsin Liu
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Abstract
A load-lock chamber with reduced particle contamination is disclosed. At least one movable particle shield is placed between the gate valve and a wafer location. Particles which can be generated due to contact between the gate valve door and its seat are blocked or inhibited by the particle shield from landing in the wafer location, reducing particle contamination. Methods for operating the load-lock chamber are also disclosed.
Claims20
A method for reducing particle contamination in a wafer transfer chamber, comprising:
- moving a wafer from a first wafer position through an opening of a gate valve to a second wafer position;
- moving a downstream shield located between the gate valve and the second wafer position from an open position to a closed position;
- and
- closing the gate valve after the downstream shield is moved to the closed position;
- wherein the downstream shield protects the wafer from any particles generated by closing the gate valve.
A method for transferring a wafer between a first pressure environment and a second pressure environment through a load-lock chamber, comprising:
- equalizing a load-lock chamber pressure to the first pressure environment;
- opening an upstream gate valve leading from the first pressure environment to the load-lock chamber;
- transferring the wafer from a first wafer position in the first pressure environment through the upstream gate valve to a load-lock wafer position in the load-lock chamber;
- closing a first shield located in the first pressure environment upstream of the upstream gate valve;
- closing the upstream gate valve;
- equalizing the load-lock chamber pressure to the second pressure environment;
- opening a downstream gate valve leading from the load-lock chamber to the second pressure environment;
- transferring the wafer from the load-lock wafer position in the load-lock chamber through the downstream gate valve to a second wafer position in the second pressure environment;
- closing a second shield located in the second pressure environment downstream of the downstream gate valve;
- and
- closing the downstream gate valve.
A method for transferring a wafer between a first pressure environment and a second pressure environment through a load-lock chamber, comprising:
- equalizing a load-lock chamber pressure to the first pressure environment;
- opening a primary gate valve leading from the first pressure environment to the load-lock chamber;
- opening a shield located in the load-lock chamber after opening the primary gate valve;
- transferring the wafer from a first wafer position in the first pressure environment through the primary gate valve to a load-lock wafer position in the load-lock chamber;
- closing the shield located in the load-lock chamber after transferring the wafer to the load-lock wafer position;
- closing the primary gate valve after the shield located in the load-lock chamber is closed;
- equalizing the load-lock chamber pressure to the second pressure environment;
- opening a secondary gate valve leading from the load-lock chamber to the second pressure environment;
- opening the shield located in the load-lock chamber after opening the secondary gate valve;
- and
- transferring the wafer from the load-lock wafer position in the load-lock chamber to a second wafer position in the second pressure environment;
- closing the shield located in the load-lock chamber;
- and
- closing the secondary gate valve after closing the shield located in the load-lock chamber.
Dependencies are inferred from the claim text.