Device for removing void in underfill material

A device for removing a void in an underfill material, comprising:

• a chamber configured to accept a substrate applied with an underfill material therein;
• a gas supply device connected to the chamber and configured to inject a first gas into the chamber to create a pressurizing atmosphere inside the chamber;
• a vacuum device connected to the chamber and configured to exhaust a second gas from the inside of the chamber to outside of the chamber to create a vacuum atmosphere inside the chamber;
• and
• a heating device disposed inside the chamber and configured to heat the substrate by irradiating light to the substrate,
• wherein the vacuum device and the gas supply device are configured to alternately operate once during each cycle of one or more cycles to create the vacuum atmosphere and the pressurizing atmosphere inside the chamber.

A device for removing a void in an underfill material, comprising:

• a chamber configured to accept a substrate applied with an underfill material therein;
• a gas supply device connected to the chamber and configured to inject a first gas into the chamber to create a pressurizing atmosphere inside the chamber;
• and
• a vacuum device connected to the chamber and configured to exhaust a second gas from the inside of the chamber to outside of the chamber to create a vacuum atmosphere inside the chamber,
• wherein the vacuum device and the gas supply device are configured to alternately operate once during each cycle of one or more cycles to create the vacuum atmosphere and the pressurizing atmosphere inside the chamber,
• and
• wherein an internal pressure of the chamber in the vacuum atmosphere is 10 torr or less.