H10P 50/613
Of group iv materials
Official title: {of Group IV materials}
H10P50/613 (Of group iv materials) appears on 224 US grants and 172 published applications in this corpus.
Search patents in H10P- Granted patents
- 224
- Published applications
- 172
- Assignees
- 138
- Inventors
- 555
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 11 | 0 |
| 2001 | 10 | 1 |
| 2002 | 5 | 10 |
| 2003 | 9 | 4 |
| 2004 | 7 | 8 |
| 2005 | 4 | 13 |
| 2006 | 7 | 6 |
| 2007 | 4 | 2 |
| 2008 | 2 | 2 |
| 2009 | 3 | 5 |
| 2010 | 4 | 2 |
| 2011 | 4 | 3 |
| 2012 | 6 | 2 |
| 2013 | 2 | 6 |
| 2014 | 4 | 1 |
| 2015 | 5 | 15 |
| 2016 | 7 | 5 |
| 2017 | 5 | 8 |
| 2018 | 6 | 6 |
| 2019 | 7 | 10 |
| 2020 | 12 | 18 |
| 2021 | 8 | 12 |
| 2022 | 11 | 7 |
| 2023 | 7 | 6 |
| 2024 | 4 | 6 |
| 2025 | 7 | 5 |
| 2026 | 1 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Forming a planar semiconductor surface17 Feb 2026US 12,557,571 B2The Boeing Company
- Wet etch apparatus2 Dec 2025US 12,489,001 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional memory device and method of making thereof using sacrificial material regrowth23 Sep 2025US 12,426,267 B2SanDisk Technologies LLC
- Semiconductor structure etching solution and method for fabricating a semiconductor structure using the same etching solution20 May 2025US 12,308,239 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for forming diamond product13 May 2025US 12,297,557 B2Element Six Technologies Limited
- Method for manufacturing a plurality of semiconductor chips24 Sep 2026US 2026/0293565 A1ams-OSRAM International GmbH
- Systems and methods for controlling porous resistivities10 Sep 2026US 2026/0271688 A1IQE plc
- Method for manufacturing microstructures6 Aug 2026US 2026/0231708 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Systems and methods for porous tool23 Jul 2026US 2026/0215203 A1IQE plc
- Method and semiconductor device30 Apr 2026US 2026/0122937 A1Hitachi Energy Ltd
Most cited
By later US patents
- Porous silicon post processing138US 10,134,837 B1QUALCOMM Incorporated · 2018
- Apparatus and method for the electrochemical etching of a wafer120US 6,103,096 AInternational Business Machines Corporation · 2000
- Method of producing semiconductor member and method of producing solar cell99US 6,190,937 B1Canon Kabushiki Kaisha · 2001
- Process for anisotropic etching of silicon plates89US 5,071,510 ARobert Bosch GmbH · 1991
- Method for making thin film semiconductor87US 6,107,213 ASony Corporation · 2000