H10P 14/45
Sputtering
H10P14/45 (Sputtering) appears on 1 US grants and 7 published applications in this corpus.
Search patents in H10P- Granted patents
- 1
- Published applications
- 7
- Assignees
- 6
- Inventors
- 18
- Latest grant
- 11 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of Providing a Multi-layer Adhesion Layer on a Workpiece17 Sep 2026US 2026/0282772 A1
- Sputtering apparatus and method of manufacturing semiconductor device20 Aug 2026US 2026/0245836 A1Mitsubishi Electric Corporation
- Semiconductor substrate, template substrate, and method and apparatus for manufacturing template substrate28 May 2026US 2026/0150687 A1KYOCERA Corporation
- Film deposition method and film deposition apparatus9 Apr 2026US 2026/0101683 A1Ulvac, Inc.
- High quality quantum computer components15 Jan 2026US 2026/0020501 A1APPLIED Materials.Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.