Sputtering apparatus and method of manufacturing semiconductor device

Abstract

An object of the present disclosure is to provide sputtering apparatus capable of preventing adhesion of sputter particles to an unnecessary area and ensuring in-plane uniformity of a film thickness distribution in a whole substrate after sputtering and a method of manufacturing a semiconductor device using the sputtering apparatus. A sputtering apparatus according to the present disclosure includes: a vacuum chamber; a stage to which a substrate is mounted in the vacuum chamber; and an adhesion preventive unit disposed to be separated from the substrate between a sputter target provided in the vacuum chamber and an end portion of the substrate, wherein the adhesion preventive unit includes an adhesion preventive unit electrode disposed via an insulating part, the stage includes a stage electrode disposed in an end portion, and a power source is disposed between the adhesion preventive unit electrode and the stage electrode.

Dependencies are inferred from the claim text.