H10H 20/019
Removal of at least a part of a substrate on which semiconductor
Official title: {Removal of at least a part of a substrate on which semiconductor layers have been formed}
H10H20/019 (Removal of at least a part of a substrate on which semiconductor) appears on 65 US grants and 225 published applications in this corpus.
Search patents in H10H- Granted patents
- 65
- Published applications
- 225
- Assignees
- 93
- Inventors
- 498
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 2 | 3 |
| 2007 | 2 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 4 |
| 2010 | 2 | 3 |
| 2011 | 4 | 3 |
| 2012 | 3 | 2 |
| 2013 | 2 | 1 |
| 2014 | 2 | 4 |
| 2015 | 3 | 2 |
| 2016 | 3 | 4 |
| 2017 | 4 | 2 |
| 2018 | 3 | 4 |
| 2019 | 2 | 2 |
| 2020 | 2 | 6 |
| 2021 | 1 | 1 |
| 2022 | 3 | 12 |
| 2023 | 1 | 21 |
| 2024 | 8 | 13 |
| 2025 | 8 | 75 |
| 2026 | 9 | 55 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a device for emitting radiation9 Jun 2026US 12,652,884 B2Centre National de la Recherche Scientifique (CNRS)
- Method of manufacturing optoelectronic devices2 Jun 2026US 12,648,261 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Light absorbing barrier for LED fabrication processes26 May 2026US 12,641,929 B2APPLIED Materials.Inc.
- Method of manufacturing micro-light emitting diode and method of manufacturing display apparatus by using the same12 May 2026US 12,628,468 B2Samsung Electronics Co., Ltd.
- Composite cathode contact for monolithically integrated micro-LEDs, mini-LEDs and LED arrays24 Mar 2026US 12,588,326 B2Lumileds Singapore Pte. Ltd.
- Method of manufacturing chip-on-wafer for micro led display17 Sep 2026US 2026/0282602 A1Wavelord Co., Ltd
- Apparatus and method for optically inspecting and removing micro led on substrate10 Sep 2026US 2026/0271433 A1Rayleigh Vision Intelligence Co. Ltd.
- Twisting method of post laser lift-off sapphire removal3 Sep 2026US 2026/0262332 A1Lumileds LLC
- Suction cup device and method for removing sapphire substrate3 Sep 2026US 2026/0262333 A1Lumileds LLC
- Beam pattern shaping with bi-convex micro-lens20 Aug 2026US 2026/0244026 A1Lumileds Singapore Pte. Ltd.
Most cited
By later US patents
- Light-emitting-diode chip comprising a sequence of GaN-based epitaxial layers which emit radiation and a method for producing the same66US 7,265,392 B2OSRAM GmbH · 2007
- Light-emitting-diode chip comprising a sequence of GAN-based epitaxial layers which emit radiation and a method for producing the same48US 7,939,844 B2OSRAM GmbH · 2011
- Methods of making multi-layer light emitting devices40US 7,083,993 B2Luminus Devices, Inc. · 2006
- High radiance LED chip and a method for producing same23US 7,306,960 B2OSRAM GmbH · 2007
- High radiance led chip and a method for producing same12US 7,026,657 B2OSRAM GmbH · 2006