Apparatus and method for optically inspecting and removing micro led on substrate

Abstract

An apparatus for optically inspecting and removing a micro-LED on a substrate is provided. The apparatus is configured to remove at least one defective chip among a plurality of micro-LEDs on the substrate. The apparatus comprises an image recognition module, a laser source, and a carrier platform. The image recognition module identifies the plurality of micro-LEDs and generates a chip positioning map, which includes the location of the at least one defective chip. The laser source emits a laser beam. The carrier platform moves the substrate according to the chip positioning map to align the at least one defective chip with the laser beam, thereby removing the at least one defective chip from the substrate. The carrier platform further moves the substrate to enable the image recognition module to capture a post-removal image of the location of the defective chip and verify the content of the post-removal image.

Dependencies are inferred from the claim text.