Method for manufacturing a device for emitting radiation

A method for manufacturing an emitting device comprising a light emitting diode configured for emitting radiation, the light emitting diode including a first portion, a second portion and an emitting portion, the first portion being made of a first semiconductor material having a first doping type, the second portion being made of a second semiconductor material having a second doping type different from the first doping type, the emitting portion being interposed between the first portion and the second portion, the emitting portion being made of a semiconductor emitting material which is configured for emitting radiation upon passage of an electric current, wherein the first semiconductor material, the second semiconductor material and the semiconductor emitting material are nitrides of group III elements, the method including the steps of:

• providing a substrate made at least partially of a semiconductor substrate material having the first doping type, wherein the semiconductor substrate material is crystalline diamond and the first doping type is p-type doping, the substrate material being transparent to radiation, the substrate having a first face delimiting the substrate along a direction normal to the first face,
• implanting through the first face a set of atoms able to form a weakened portion in the substrate material, the weakened portion extending parallel to the first face, the substrate further including a surface portion and an internal portion, the weakened portion separating the surface portion from the internal portion along the normal direction,
• formation on the first face of the light-emitting diode by depositing at least the first material, the emitting material and the second material, the first portion being interposed along the normal direction between the emitting portion and the first face, the surface portion of the substrate being rigidly attached to the first portion, the light-emitting diode being delimited along the normal direction by the first face and by an end face of the second portion,
• bonding the end face to a second face of a support, the second portion being interposed along the normal direction between the support and the emitting portion, and
• breaking the weakened portion so as to separate the surface portion of the substrate material from the internal portion of the substrate material.