H10D 62/117
Shapes of semiconductor bodies
Official title: {Shapes of semiconductor bodies}
H10D62/117 (Shapes of semiconductor bodies) appears on 12,870 US grants and 18,216 published applications in this corpus.
Search patents in H10D- Granted patents
- 12,870
- Published applications
- 18,216
- Assignees
- 1,597
- Inventors
- 15,519
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 9 | 0 |
| 1978 | 9 | 0 |
| 1979 | 12 | 0 |
| 1980 | 10 | 0 |
| 1981 | 8 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 11 | 0 |
| 1986 | 11 | 0 |
| 1987 | 8 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 17 | 0 |
| 1991 | 19 | 0 |
| 1992 | 17 | 0 |
| 1993 | 17 | 0 |
| 1994 | 22 | 0 |
| 1995 | 17 | 0 |
| 1996 | 24 | 0 |
| 1997 | 21 | 0 |
| 1998 | 50 | 0 |
| 1999 | 50 | 0 |
| 2000 | 50 | 0 |
| 2001 | 57 | 36 |
| 2002 | 57 | 79 |
| 2003 | 80 | 98 |
| 2004 | 79 | 141 |
| 2005 | 90 | 200 |
| 2006 | 110 | 206 |
| 2007 | 134 | 260 |
| 2008 | 128 | 277 |
| 2009 | 166 | 282 |
| 2010 | 246 | 323 |
| 2011 | 266 | 372 |
| 2012 | 297 | 316 |
| 2013 | 331 | 361 |
| 2014 | 392 | 510 |
| 2015 | 494 | 616 |
| 2016 | 616 | 687 |
| 2017 | 690 | 753 |
| 2018 | 705 | 687 |
| 2019 | 743 | 761 |
| 2020 | 735 | 963 |
| 2021 | 770 | 1048 |
| 2022 | 863 | 1484 |
| 2023 | 884 | 1962 |
| 2024 | 1083 | 2030 |
| 2025 | 1384 | 2418 |
| 2026 | 1054 | 1346 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor memory devices with dielectric fin structures6 Oct 2026US 12,755,790 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Selective deposition of gate dielectric layer of semiconductor device and the semiconductor device manufactured thereby6 Oct 2026US 12,757,424 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive bridge through dielectric wall between source or drain contacts6 Oct 2026US 12,757,439 B2Intel Corporation
- Semiconductor structure and method for forming the same6 Oct 2026US 12,757,440 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Contact formation with staggered gate patterning6 Oct 2026US 12,757,441 B2International Business Machines Corporation
- Semiconductor structure and method for manufacturing the same8 Oct 2026US 2026/0313867 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-channel ferroelectric memory structure8 Oct 2026US 2026/0313908 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0313928 A1National Taiwan University
- Multi-gate device fabrication and structures thereof8 Oct 2026US 2026/0313936 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method for forming the same8 Oct 2026US 2026/0313940 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- FINFETs with wrap-around silicide and method forming the same1,436US 9,608,116 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Vertical gate all around (VGAA) transistors and methods of forming the same1,029US 9,502,265 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Vertical gate all around (VGAA) devices and methods of manufacturing the same987US 9,536,738 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Implantable substrate sensor976US 6,259,937 B1Alfred E. Mann Foundation · 2001
- Glucose sensor915US 6,546,268 B1Ball Semiconductor, Inc. · 2003