H10D 62/01
Manufacture or treatment
Official title: {Manufacture or treatment}
H10D62/01 (Manufacture or treatment) appears on 4,760 US grants and 5,552 published applications in this corpus.
Search patents in H10D- Granted patents
- 4,760
- Published applications
- 5,552
- Assignees
- 498
- Inventors
- 5,472
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 8 | 0 |
| 1997 | 10 | 0 |
| 1998 | 17 | 0 |
| 1999 | 14 | 0 |
| 2000 | 27 | 0 |
| 2001 | 22 | 17 |
| 2002 | 37 | 54 |
| 2003 | 60 | 56 |
| 2004 | 56 | 79 |
| 2005 | 52 | 130 |
| 2006 | 93 | 196 |
| 2007 | 90 | 236 |
| 2008 | 133 | 287 |
| 2009 | 162 | 232 |
| 2010 | 204 | 201 |
| 2011 | 219 | 226 |
| 2012 | 189 | 283 |
| 2013 | 258 | 310 |
| 2014 | 306 | 301 |
| 2015 | 307 | 364 |
| 2016 | 384 | 364 |
| 2017 | 326 | 291 |
| 2018 | 311 | 244 |
| 2019 | 261 | 261 |
| 2020 | 258 | 281 |
| 2021 | 177 | 215 |
| 2022 | 197 | 230 |
| 2023 | 163 | 194 |
| 2024 | 157 | 177 |
| 2025 | 163 | 176 |
| 2026 | 69 | 147 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing semiconductor structure with source/drain structure having modified shape6 Oct 2026US 12,757,422 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Low-K gate spacer and methods for forming the same6 Oct 2026US 12,757,467 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of forming a nano-FET semiconductor device having a spacer with a reducer seam1 Sep 2026US 12,727,227 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing FinFET devices with backside power rail and backside self-aligned via25 Aug 2026US 12,720,795 B2Taiwan Semiconductor Manfacturing Company, Ltd.
- Semiconductor device including a first element structure with a column layer and a second element structure25 Aug 2026US 12,720,849 B2Rohm Co., Ltd.
- Systems and methods for fabrication of a part with an embedded quantum sensor8 Oct 2026US 2026/0309812 A1Toyota Jidosha Kabushiki Kaisha
- Memory device and manufacturing method thereof8 Oct 2026US 2026/0313901 A1Taiwan Semiconductor Manufacturing Company.Ltd
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method for forming the same8 Oct 2026US 2026/0313969 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Doping profile for strained source/drain region8 Oct 2026US 2026/0313975 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Strained structure of semiconductor device and method of making the strained structure614US 9,171,929 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Cyclical epitaxial deposition and etch580US 8,367,528 B2ASM America, Inc. · 2013
- Strained channel integrated circuit devices569US 8,729,627 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014