H05K 9/0024
Shield cases mounted on a pcb
Official title: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields}
H05K9/0024 (Shield cases mounted on a pcb) appears on 954 US grants and 1,120 published applications in this corpus.
Search patents in H05K- Granted patents
- 954
- Published applications
- 1,120
- Assignees
- 432
- Inventors
- 2,505
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 17 | 0 |
| 1999 | 8 | 0 |
| 2000 | 14 | 0 |
| 2001 | 31 | 3 |
| 2002 | 23 | 20 |
| 2003 | 14 | 21 |
| 2004 | 18 | 22 |
| 2005 | 15 | 23 |
| 2006 | 18 | 22 |
| 2007 | 13 | 27 |
| 2008 | 14 | 27 |
| 2009 | 24 | 43 |
| 2010 | 13 | 31 |
| 2011 | 25 | 32 |
| 2012 | 16 | 31 |
| 2013 | 25 | 50 |
| 2014 | 22 | 42 |
| 2015 | 26 | 41 |
| 2016 | 36 | 40 |
| 2017 | 33 | 72 |
| 2018 | 59 | 77 |
| 2019 | 73 | 56 |
| 2020 | 69 | 73 |
| 2021 | 45 | 56 |
| 2022 | 47 | 66 |
| 2023 | 45 | 80 |
| 2024 | 57 | 75 |
| 2025 | 74 | 52 |
| 2026 | 39 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 9/0032Having multiple parts467
- H05K 9/0026Integrally formed from metal sheet318
- H05K 9/003Made from non-conductive materials comprising an electro-conductive coating65
- H05K 9/0031Combining different shielding materials45
- H05K 9/0029Made from non-conductive materials intermixed with electro-conductive particles13
Recent patents
- Semiconductor apparatus6 Oct 2026US 12,757,364 B2Fuji Electric Co., Ltd.
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Systems and methods for fastening compression-attached memory module to a circuit board29 Sep 2026US 12,750,993 B2Dell Products L. P.
- Nested RF shield system for a tuner circuit8 Sep 2026US 12,733,143 B2Dish Wireless L. L. C.
- Electronic device comprising heat dissipation structure providing heat transfer path18 Aug 2026US 12,713,563 B2Samsung Electronics Co., Ltd.
- Display device1 Oct 2026US 2026/0304718 A1LG Display Co., Ltd.
- Integrated electromagnetic interference shield1 Oct 2026US 2026/0304720 A1STMicroelectronics International N. V.
- Electronic package modules with intra-module electromagnetic interference shielding1 Oct 2026US 2026/0304721 A1Skyworks Solutions, Inc.
- Method of providing intra-module electromagnetic interference shielding to an electronic package module1 Oct 2026US 2026/0304722 A1Skyworks Solutions, Inc.
- Radio-frequency/electromagnetic shielding for system-in-package10 Sep 2026US 2026/0271252 A1Meta Platforms Technologies, LLC
Most cited
By later US patents
- Heat sink and thermal interface having shielding to attenuate electromagnetic interference192US 6,483,707 B1Loctite Corporation · 2002
- Circuit board RF shielding189US 6,239,359 B1Lucent Technologies Inc. · 2001
- Conforming shielded form for electronic component assemblies145US 6,483,719 B1Spraylat Corporation · 2002
- Gel structure for combined EMI shielding and thermal control of microelectronic assemblies133US 6,195,267 B1Ericsson Inc. · 2001
- Circuit board assembly120US 5,400,949 ANokia Mobile Phones Ltd. · 1995